Gigabyte B660I AORUS PRO - Intel B660 DDR4 Mini-ITX Motherboard

What's Included-

Features-

PERFORMANCE UNLEASHED

Rule supreme with the B660 AORUS gaming motherboards. The new king of gaming platform continues the legendary AORUS bloodline with the most robust power delivery and dominant thermal design, glorified with the complete memory overclocking technology to crown your PC with the best Alder Lake's performance in all its gaming glory.

UNPARALLELED PERFORMANCE

With technology moving so fast, GIGABYTE still keep up with the latest trends and provide our customers with advanced features and latest technology. GIGABYTE B660 Series motherboards come with upgraded power solution, latest storage standards and outstanding connectivity to enable optimize performance for gaming.

Direct Digital VRM Design

To ensure maximum Turbo Boost and performance of Intel's new generation CPU, GIGABYTE B660 series equip the best VRM design ever built with the highest quality components.

Support for DDR4 XMP Up to 5333MHz and Beyond*

AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5333MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

* XMP Profile support may vary depending on memory module.

PCIe 4.0 x4 M2

AORUS motherboards offer the industry's best compatibility in terms of NVMe storage for users who demand high capacity and seek the best performance. Upgrade with the latest 2nd generation Gen4 SSD, the performance is up to 7000MB/s which is up to 2x faster than PCIe3.0 SSD.

Hybrid Cores Optimization

With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.

ADVANCED THERMAL SOLUTION

GIGABYTE B660 Series Motherboards' Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming.

3% Cooler by implementing 2X copper PCB Design

By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it's high thermal conductivity and lower impedance.